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PACDN1404
PACKAGE DIMENSIONS
WLCSP6, 1.80x1.15
CASE 567BD ? 01
ISSUE O
PIN A1
REFERENCE
D
A
B
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
2X
2X
0.05 C
0.05 C
TOP VIEW
A2
DIM
A
A1
A2
b
D
E
e
MIN MAX
0.60 0.69
0.23 0.29
0.38 REF
0.34 0.39
1.80 BSC
1.15 BSC
0.65 BSC
0.05 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
A1
0.05 C
NOTE 3
SIDE VIEW
C
SEATING
PLANE
A1
PACKAGE
OUTLINE
6X b
0.05 C A B
0.03 C
B
A
e
e
0.65
PITCH
6X
0.25
0.65
PITCH
DIMENSIONS: MILLIMETERS
1 2 3
BOTTOM VIEW
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
4
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